Nika-2013 PS

Product Description

A machine for thick metal coating deposition through magnetron sputtering.

Purpose: deposition of thick metal coatings on ceramic substrates by thermal evaporation in magnetron discharge. Metal (Cr, Ti, Ta) or dielectric underalyers may be deposited to ensure conductive layer adhesion. In the latter case, resistive losses in microwave circuits are minimized.

Processes:

  • ion-beam cleaning of substrates;
  • magnetron sputtering of metal targets;
  • magnetron sputtering of magnetic materials (nickel);
  • thermal evaporation in magnetron discharge with a high speed of deposition (up to 1 µm/min on a rotating carrousel, up 60 µm full thickness for the whole batch);
  • dielectric underlayer deposition (optional);

 

Configuration:

  • II-400 ion source;
  • magnetron-400 for metallic (Cr, Ti, Ta) or dielectric underlayer deposition;
  • magnetron-400 for thick metal coating deposition (Cu, AG) by thermal evaporation in magnetron discharge;
  • magnetron-400 for deposition of a protective Ni layer;
  • drum for single- or double-side deposition;
  • two plasma-forming gas supply ducts;
  • heater (optional).

Additional Information

Form of the process chamber

Cylindrical

Number of channels of a working gas

2

Number of magnetrons

3

Cathode Thickness, mm

20

Max Discharge Power, W

12000

Maximum cathode length, mm

400

Minimum cathode length, mm

400

Maximum cathode width, mm

80

Minimum cathode width, mm

80

Number of ion sources

1

ООО “Лаборатория вакуумных технологий”

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